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CMOS compatible 3D flow and thermal sensors in SOI technology

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André, Nicolas [UCL] Iker, François [UCL] Jorez, S. Raskin, Jean-Pierre [UCL]

Three-dimensional (3D) self-assembled microstructures are employed in various applications ranging from isolated inductors to tunable capacitors or micro-mirrors. In this article, we present interdigitated capacitors for flow and thermal sensing and circular-shaped bolometers for thermal applications, both based on a one-mask CMOS compatible silicon-on-insulator (SOI) process. We obtained a detection range of 0 to 20 m/s for flow with a variation of 450 MHz in resonance frequency or 9 fF in capacitance for a change of one meter per second and a detection range of 20 to 320 degrees C with a variation of 600 MHz in resonance frequency for a change of 10 degrees C. These flow and thermal sensors were also studied from a theoretical point of view simulating the capacitive transducer using finite element softwares which agreed well with measurements.

Document type Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection
Publication date 2005
Conference "2005 IEEE Sensors", Irvine, CA, USA (30 October-3 November 2005)
Peer reviewed yes
Host document "2005 IEEE Sensors (IEEE Cat. No.05CH37665C)"- 4 pp. (ISBN : 0-7803-9056-3)
Publisher IEEE
Publication status Publié
Affiliation UCL - FSA/ELEC - Département d'électricité
Links
Bibliographic reference André, Nicolas ; Iker, François ; Jorez, S. ; Raskin, Jean-Pierre. CMOS compatible 3D flow and thermal sensors in SOI technology.2005 IEEE Sensors (Irvine, CA, USA, 30 October-3 November 2005). In: 2005 IEEE Sensors (IEEE Cat. No.05CH37665C), IEEE2005, p.4 pp.
Permanent URL http://hdl.handle.net/2078.1/67930