Copper/SiC Heat Sink Materials: Optimisation by Ttitanium as Coupling Agent

Pippel, E.; Woltersdorf, J.; Brendel, A.; Bolt, H.-H.

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Copper/SiC Heat Sink Materials: Optimisation by Ttitanium as Coupling Agent

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Pippel, E.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

Woltersdorf, J.
Max Planck Society;

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Brendel, A.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

Bolt, H.-H.
Max Planck Society;

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Pippel, E., Woltersdorf, J., Brendel, A., & Bolt, H.-H. (2005). Copper/SiC Heat Sink Materials: Optimisation by Ttitanium as Coupling Agent. Poster presented at European Congress on Advanced Materials and Processes (EUROMAT 2005), Prague.

Cite as: https://hdl.handle.net/21.11116/0000-0000-0F01-F

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