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Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography

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Arigela,  Viswanadh Gowtham
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons75388

Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography. Poster presented at Materials Chain International Conference, Bochum, Germany, Bochum, Germany.


Cite as: https://hdl.handle.net/21.11116/0000-0005-470B-0
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