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タイトル: Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components
著者: Yan, Yabin
Sumigawa, Takashi  kyouindb  KAKEN_id  orcid https://orcid.org/0000-0002-5713-4072 (unconfirmed)
Shang, Fulin
Kitamura, Takayuki  KAKEN_id
キーワード: Interface
Cohesive zone model
Nano-component
Delamination
Nanoscale
Crack initiation
Crack propagation
Interface crack
Thin film
Plasticity
Residual stress
発行日: Dec-2011
出版者: Elsevier Ltd.
誌名: Engineering Fracture Mechanics
巻: 78
号: 17
開始ページ: 2935
終了ページ: 2946
抄録: Crack initiation and propagation along the Cu/Si interface in multilayered films (Si/Cu/SiN) with different thicknesses of the Cu layer (20 and 200 nm) are experimentally investigated using a nano-cantilever and millimeter-sized four-point bending specimens. To examine the cohesive zone model (CZM) criterion for interfacial delamination along the Cu/Si interface in nanoscale stress concentration, an exponential type of CZM is utilized to simulate the observed delamination processes using the finite element method. After the CZM parameters for the Cu/Si interface are calibrated by experiment, interface cracking in other experiments is predicted. This indicates that the CZM criterion is universally applicable for describing cracking along the interface regardless of specimen dimensions and film thickness which include the differences in plastic behavior and residual stress. The CZM criterion can also predict interfacial cracking along Cu/Si interfaces with different stress singularities.
著作権等: © 2011 Elsevier Ltd.
この論文は出版社版でありません。引用の際には出版社版をご確認ご利用ください。
This is not the published version. Please cite only the published version.
URI: http://hdl.handle.net/2433/152347
DOI(出版社版): 10.1016/j.engfracmech.2011.08.010
出現コレクション:学術雑誌掲載論文等

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