Publications
Detailed Information
Study on the fabrication of flip chip lead-free solder bump by electroplating : 전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 강춘식
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Description
- Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061997
https://hdl.handle.net/10371/30333
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.