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Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs
Cited 32 time in
Web of Science
Cited 38 time in Scopus
- Authors
- Issue Date
- 2004-09-07
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 7(10) C118-C120
- Keywords
- silver ; additives ; metallic thin films ; electroplating ; inhibitors ; electrolytes ; copper ; organic compounds
- Abstract
- For Ag electroplating in a damascene structure, two additives were tried in the electrolyte composed of KAg(CN)2 and KCN. One
additive, thiourea, played a role as a suppressor and a brightener on a Ag seed layer. The other additive, benzotriazole, worked as
an inhibitor on a Cu seed layer whereas it acted as an accelerator on the Ag seed layer. When these two additives were added to
the electrolyte, the superconformal electroplating of Ag thin film for ultralarge scale integrateds ~ULSIs! was accomplished
successfully without defects in the damascene structure with a width of 400 nm and an aspect ratio was 4.
- ISSN
- 1099-0062
- Language
- English
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