Thermoelectric devices are useful for a variety of applications due to their ability to either convert heat directly into electricity, or to generate a temperature gradient from an electric current. These devices offer several attractive features including compact size, no moving parts, limited maintenance requirements, and high reliability. Thus thermoelectric devices are used for temperature-control, cooling, or power generation in various industrial systems such as automobiles, avionics, refrigerators, chillers, laser diodes, dehumidifiers, and a variety of sensors. In order to improve the efficiency of thermoelectric devices, many endeavors have been made to design and fabricate materials with a higher dimensionless thermoelectric figure of merit (ZT), as well as to optimize the device structure and packaging to manage heat more effectively. When evaluating candidate thermoelectric materials, one must accurately characterize the electrical conductivity, thermal conductivity, and the Seebeck coefficient over the temperature range of potential use. However, despite considerable research on thermoelectric materials for decades, there is still significant scatter and disagreement in the literature regarding accurate characterization of these properties due to inherent difficulties in the measurements such as requirements for precise control of temperature, simultaneous evaluation of voltage and temperature, etc. Thus, a well-designed and well-calibrated thermoelectric measurement system that can meet the requirements needed for multiple kinds of thermoelectric materials is an essential tool for the development of advanced thermoelectric devices.

In this dissertation, I discuss the design, fabrication, and validation of a measurement system that can rapidly and accurately evaluate the Seebeck coefficient and electrical resistivity of thermoelectric materials of various shapes and sizes from room temperature up to 600 K. The methodology for the Seebeck coefficient and electrical resistivity measurements is examined along with the optimization and application of both in the measurement system. The calibration process is completed by a standard thermoelectric material and several other materials, which demonstrates the accuracy and reliability of the system.

While a great deal of prior research has focused on low temperature thermoelectric materials for cooling, such as Bi2Te3, high temperature thermoelectric materials are receiving increasing attention for power generation. With the addition of commercial systems for the Seebeck coefficient, electrical resistivity, and thermal conductivity measurements to expand the temperature range for evaluation, a wide range of materials can be studied and characterized. Chapter Two of this dissertation describes the physical properties characterization of a variety of thermoelectric materials, including room temperature materials such as Bi0.5Sb1.5Te3, medium temperature level materials such as skutterudites, and materials for high temperature applications such as half-Heusler alloys. In addition, I discuss the characterization of unique oxide thermoelectric materials, which are Al doped ZnO and Ca-Co-O systems for high temperature applications.

Chapter Four of this dissertation addresses the use of GaSn alloys as a thermal interface material (TIM), to improve thermal transport between thermoelectric devices and heat sinks for power generation applications at high temperature. I discuss the mechanical and thermal behavior of GaSn as an interface material between electrically insulating AlN and Inconel heat exchangers at temperatures up to 600 °C. Additionally, a theoretical model for the experimental thermal performances of the GaSn interface layer is also examined.