Effects of Pulse Electroplating Parameters on Return Loss (S11) and Surface Roughness of Silver Coatings

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2019-05-01

Author

Başaran, Caner
Karakaya, İshak

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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The highly conductive silver is widely used in the electronics industry, especially in microwave systems [1]. A silver-plated part will reduce loss at the highest microwave frequencies. In addition to this, it will carry extremely high current load. Surface roughness which distorts the propagation of electromagnetic waves is known to affect the uniformity of the current distribution of very good conductive metals such as silver [1]. The effects of duty cycle, frequency and average current density, which are pulsed silver-plating parameters, on the surface quality of coating have been investigated in this study. These effects have been examined by comparing the return loss (S11). S11 comparisons were made according to a reference gold plate. When S11 comparisons have been made, increasing return loss appears with increasing surface roughness. These effects have been characterized by SEM and XRD.

Subject Keywords

Horn antenna, Pulse electroplating , Return loss, Roughness , Scattering parameter , Silver, Waveguide

URI

https://hdl.handle.net/11511/37690

Journal

ECSArxiv

DOI

https://doi.org/10.1149/osf.io/84qzx

Collections

Department of Metallurgical and Materials Engineering, Article

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Citation Formats

C. Başaran and İ. Karakaya, “Effects of Pulse Electroplating Parameters on Return Loss (S11) and Surface Roughness of Silver Coatings,” ECSArxiv, pp. 0–0, 2019, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/37690.