Park, Y. B. Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Park, Y. B., & Jeon, I. S. (2003). Mechanical stress evolution in metal interconnects for various line aspect ratios and passivation dielectrics. Microelectronic Engineering, 69(1), 26-36.