Grain boundary segregation engineering in metallic alloys: A pathway to the 
design of interfaces

Raabe, Dierk; Herbig, Michael; Sandlöbes, Stefanie; Li, Yujiao; Tytko, Darius; Kuzmina, Margarita; Ponge, Dirk; Choi, Pyuck-Pa

doi:10.1016/j.cossms.2014.06.002

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Grain boundary segregation engineering in metallic alloys: A pathway to the design of interfaces

MPS-Authors

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Raabe, Dierk
Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125176

Herbig, Michael
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125360

Sandlöbes, Stefanie
Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125256

Li, Yujiao
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125439

Tytko, Darius
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons134381

Kuzmina, Margarita
Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125320

Ponge, Dirk
Alloy Design and Thermomechanical Processing, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125088

Choi, Pyuck-Pa
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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引用

Raabe, D., Herbig, M., Sandlöbes, S., Li, Y., Tytko, D., Kuzmina, M., Ponge, D., & Choi, P.-P. (2014). Grain boundary segregation engineering in metallic alloys: A pathway to the design of interfaces. Current Opinion in Solid State and Materials Science, 18(4), 253-261. doi:10.1016/j.cossms.2014.06.002.

引用: https://hdl.handle.net/11858/00-001M-0000-0023-DC07-2

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