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Journal Article

Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

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Philippi,  Bastian
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Department of Materials Physics, University of Leoben, Austrian Academy of Sciences, Austria;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Philippi, B., Matoy, K., Zechner, J., Kirchlechner, C., & Dehm, G. (2016). Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. Scripta Materialia, 123, 38-41. doi:10.1016/j.scriptamat.2016.05.039.


Cite as: https://hdl.handle.net/11858/00-001M-0000-002D-96E8-7
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