chemical sensors; electronic packaging thermal management; Electronics packaging; microassembly; microsensors; Electronic Packaging; Electronic packaging thermal managements; Heating system; Low thermal conductivity; Low-costs; Metal oxide sensors; Metal-oxides gas sensors; Microassemblies; Power demands; Computer Science (all); Materials Science (all); Engineering (all); General Engineering; General Materials Science; General Computer Science
Abstract :
[en] Metal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever-increasing demand for MOX gas sensors, there is a clear need for a low cost, compact and high-performance package. During normal operation, MOX sensors are heated up to a temperature in the typical range of 200-300°C. However, the generated heat must not damage or degrade any other part of the assembly. Using 3D finite elements modelling, we developed an optimal package configuration. To thermally insulate the assembly from the heated MOX sensor we have developed in-house a low thermal conductivity xerogel-epoxy composite with 22.7% by weight xerogel and a thermal conductivity of 107.9 mW m-1 K-1 which is a reduction exceeding 30% compared to commercially available epoxy. Based on the low thermal conductivity xerogel-epoxy composite, we have developed a novel packaging approach that can suit the large family of MOX sensors. The developed alternative packaging solution includes a small number of assembly steps and uses standard processes and techniques. The assembled MOX sensor is low cost and has a low power consumption, while all thermally sensitive assembly parts remain at low temperature during the system's lifetime.
Research center :
CRIM - Ingénierie des matériaux
Disciplines :
Electrical & electronics engineering
Author, co-author :
Stoukatch, Serguei ; Department of Electrical Engineering and Computer Science, Microsys Laboratory, University of Liege, Seraing, Belgium
Fagnard, Jean-Francois ; Department of Electrical Engineering and Computer Science, Microsys Laboratory, University of Liege, Seraing, Belgium
Dupont, Francois ; Department of Electrical Engineering and Computer Science, Microsys Laboratory, University of Liege, Seraing, Belgium
Laurent, Philippe; Department of Electrical Engineering and Computer Science, Microsys Laboratory, University of Liege, Seraing, Belgium
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