Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers
Authors
Lay, Nicole E.
ORCID
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Other Contributors
Duquette, D. J.
Ramanath, G. (Ganpati)
Shima, Mutsuhiro
Lu, T.-M. (Toh-Ming), 1943-
Ramanath, G. (Ganpati)
Shima, Mutsuhiro
Lu, T.-M. (Toh-Ming), 1943-
Issue Date
2006-05
Keywords
Materials science and engineering
Degree
PhD
Terms of Use
This electronic version is a licensed copy owned by Rensselaer Polytechnic Institute, Troy, NY. Copyright of original work retained by author.
Full Citation
Abstract
Description
May 2006
School of Engineering
School of Engineering
Department
Dept. of Materials Science and Engineering
Publisher
Rensselaer Polytechnic Institute, Troy, NY
Relationships
Rensselaer Theses and Dissertations Online Collection
Access
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