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Materials for high-density electronic packaging and interconnectionElectronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.
Document ID
19900017733
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Date Acquired
September 6, 2013
Publication Date
April 10, 1990
Publication Information
ISBN: 0-309-04233-X
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
AD-A222985
LC-90-60385
NAS 1.26:186934
NASA-CR-186934
NMAB-449
Accession Number
90N27049
Funding Number(s)
CONTRACT_GRANT: MDA903-89-K-0078
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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