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Study of bonding methods for flip chip and beam leaded devicesThe results are presented of a comprehensive study and evaluation for the bonding of flip chip and beam leaded devices onto hybrid microcircuit substrates used in high reliability space applications. The program included the evaluation of aluminum flip chips, solder (silver/tin) bump chips, gold beam leaded devices, and aluminum beam leaded devices.
Document ID
19720004767
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Rudd, H. C. (Electronic Communications, Inc. Saint Petersburg, FL, United States)
Colbert, D. C. (Electronic Communications, Inc. Saint Petersburg, FL, United States)
Date Acquired
August 6, 2013
Publication Date
October 1, 1971
Subject Category
Machine Elements And Processes
Report/Patent Number
SIER-71-0282
NASA-CR-123991
Accession Number
72N12416
Funding Number(s)
CONTRACT_GRANT: NAS8-25615
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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