sensors-23-06357.pdf (12.46 MB)
BDS dual-frequency carrier phase multipath hemispherical map model and its application in real-time deformation monitoring
journal contribution
posted on 2024-01-26, 10:08 authored by Ao Sun, Qiuzhao Zhang, Xingwang Gao, Xiaolin Meng, Yunlong Zhang, Craig HancockCraig HancockThe BDS multipath delay error is highly related to the surrounding monitoring environment, which cannot be eliminated or mitigated by applying the double difference observation model. In the actual monitoring environment, due to the complexity of the BDS constellation, it is difficult for existing algorithms to consider GEO, IGSO, MEO and other different orbital types of satellites for real-time and efficient multipath error reduction. Therefore, we propose a novel BDS dual-frequency multipath error reduction method for real deformation monitoring for BDS considering various satellite orbit types. This method extracts the single error residual of each satellite based on the assumption of “zero mean” and divides the appropriate grid density of GEO and IGSO/MEO, respectively, to construct a dual-frequency multipath hemispherical map model suitable for BDS satellites with different orbital types. This method can realize the multipath error elimination of the observed values of different orbits and different frequencies. The results of simulation experiments and real deformation monitoring data demonstrate that this method can effectively eliminate low-frequency multipath delay errors in the observation domain and coordinate domain. After multipath correction, the precision of the horizontal coordinates and height coordinates are 1.7 mm and 4.6 mm. The precision of the horizontal coordinate and height coordinate is increased by 50% and 60%, respectively. The fixed rate of ambiguity increased by 5–7%.
Funding
Fundamental Research Funds for the Central Universities (No. 2019XKQYMS52)
Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)
History
School
- Architecture, Building and Civil Engineering
Published in
SensorsVolume
23Issue
14Publisher
MDPIVersion
- VoR (Version of Record)
Rights holder
© the authorsPublisher statement
This is an Open Access Article. It is published by MDPI under the Creative Commons Attribution 4.0 International Licence (CC BY). Full details of this licence are available at: https://creativecommons.org/licenses/by/4.0/Acceptance date
2023-07-10Publication date
2023-07-13Copyright date
2023eISSN
1424-8220Publisher version
Language
- en