Adelaide Research & Scholarship
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https://hdl.handle.net/2440/133676
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| Type: | Conference paper |
| Title: | Unclad microphotonic waveguide bend |
| Author: | Headland, D. Withayachumnankul, W. Fujita, M. Nagatsuma, T. |
| Citation: | International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2020, vol.2020, pp.[416]-[417] |
| Publisher: | IEEE |
| Publisher Place: | online |
| Issue Date: | 2020 |
| Series/Report no.: | International Conference on Infrared Millimeter and Terahertz Waves |
| ISBN: | 9781728166209 |
| ISSN: | 2162-2027 2162-2035 |
| Conference Name: | International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) (8 Nov 2020 - 13 Nov 2020 : virtual online) |
| Statement of Responsibility: | Daniel Headland, Withawat Withayachumnankul, Masayuki Fujita, and Tadao Nagatsuma |
| Abstract: | A viable approach to realize substrateless, unclad terahertz silicon waveguides is presented, and a 90° bend is selected as a test case to validate the concept. This presents a promising pathway towards an efficient, versatile, and general-purpose waveguiding platform for the terahertz range. |
| Rights: | ©2020 IEEE |
| DOI: | 10.1109/IRMMW-THz46771.2020.9370857 |
| Grant ID: | http://purl.org/au-research/grants/arc/DP180103561 |
| Published version: | https://ieeexplore.ieee.org/xpl/conhome/9370343/proceeding |
| Appears in Collections: | Electrical and Electronic Engineering publications |
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