Multimode Equivalent Network for Boxed Multilayer Arbitrary Planar Circuits

Abstract

The multimode equivalent network (MEN) formulation has been originally developed for the efficient and accurate analysis of waveguide devices. In this article, we extend the use of the MEN to the analysis of zero-thickness, planar printed circuits in a metallic enclosure. The formulation is developed for metallic areas of arbitrary shape and includes both internal and external ports in the transverse plane to model connections to external components, and coaxial input/output ports. The boundary integral resonant mode expansion (BI-RME) method is used for the analysis of the arbitrary shape metallizations. On this basis, shielded multilayered microstrip circuits of complex geometry are analyzed in the common frame of the MEN technique. To validate the theoretical formulation, several boxed microstrip structures are analyzed, including multilayered configurations with several metallization interfaces, showing good agreement with respect to both other commercial tools, and measurements.