Title:
Multilayer Electronic Component Systems And Methods Of Manufacture
Multilayer Electronic Component Systems And Methods Of Manufacture
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Abstract
Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
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11/16/2010
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Text
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Patent