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Record link: 
http://hdl.handle.net/20.500.12708/77136
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Title: 
Laser De-bonding from Silicon Wafers with Picosecond 2.09-μm Holmium Laser
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Citation: 
Astrauskas, I., Povazay, B., Pugzlys, A., & Baltuska, A. (2020). Laser De-bonding from Silicon Wafers with Picosecond 2.09-μm Holmium Laser. In Conference on Lasers and Electro-Optics. Online Conference CLEO USA 2020, Washington, United States of America (the). https://doi.org/10.1364/cleo_at.2020.aw4i.7
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Publisher DOI: 
10.1364/cleo_at.2020.aw4i.7
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Astrauskas, Ignas 
Povazay, Boris 
Pugzlys, Audrius 
Baltuska, Andrius 
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Organisational Unit: 
E387-01 - Forschungsbereich Photonik 
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Published in: 
Conference on Lasers and Electro-Optics 
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Date (published): 
2020
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Event name: 
Online Conference CLEO USA 2020 
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Event date: 
10-May-2020 - 15-May-2020
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Event place: 
Washington, United States of America (the)
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Number of Pages: 
2
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Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
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Appears in Collections:
Conference Paper

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