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3-D capacitive MEMS sensors co-integrated with SOI CMOS circuits
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| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
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| Publication date | 2008 |
| Language | Anglais |
| Conference | "Fourth Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits (EUROSOI 2008)", Tyndall National Institute, Cork (Ireland) (du 23/01/2008 au 25/01/2008) |
| Peer reviewed | yes |
| Host document | "Proceedings of the EUROSOI - 2008, Fourth Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits"- 75-76 |
| Publication status | Publié |
| Affiliation | UCL - FSA/ELEC - Département d'électricité |
| Keywords | MEMS ; Sensors ; SOI CMOS |
| Links |
| Bibliographic reference | André, Nicolas ; Rue, Bertrand ; Renaux, Christian ; Flandre, Denis ; Raskin, Jean-Pierre. 3-D capacitive MEMS sensors co-integrated with SOI CMOS circuits.Fourth Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits (EUROSOI 2008) (Tyndall National Institute, Cork (Ireland), du 23/01/2008 au 25/01/2008). In: Proceedings of the EUROSOI - 2008, Fourth Workshop of the Thematic Network on Silicon on Insulator technology, devices and circuits, 2008, p.75-76 |
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| Permanent URL | http://hdl.handle.net/2078.1/90294 |